JPS6130287Y2 - - Google Patents
Info
- Publication number
- JPS6130287Y2 JPS6130287Y2 JP1981182890U JP18289081U JPS6130287Y2 JP S6130287 Y2 JPS6130287 Y2 JP S6130287Y2 JP 1981182890 U JP1981182890 U JP 1981182890U JP 18289081 U JP18289081 U JP 18289081U JP S6130287 Y2 JPS6130287 Y2 JP S6130287Y2
- Authority
- JP
- Japan
- Prior art keywords
- storage case
- case
- semiconductor pellet
- protrusion
- terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000008188 pellet Substances 0.000 claims description 16
- 239000004065 semiconductor Substances 0.000 claims description 16
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 claims 1
- 239000002131 composite material Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1981182890U JPS5887352U (ja) | 1981-12-10 | 1981-12-10 | 半導体ペレツト収納ケ−ス |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1981182890U JPS5887352U (ja) | 1981-12-10 | 1981-12-10 | 半導体ペレツト収納ケ−ス |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5887352U JPS5887352U (ja) | 1983-06-14 |
JPS6130287Y2 true JPS6130287Y2 (en]) | 1986-09-05 |
Family
ID=29981660
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1981182890U Granted JPS5887352U (ja) | 1981-12-10 | 1981-12-10 | 半導体ペレツト収納ケ−ス |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5887352U (en]) |
-
1981
- 1981-12-10 JP JP1981182890U patent/JPS5887352U/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS5887352U (ja) | 1983-06-14 |
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